Material

FR-4 , FR-5 ,CEM-3 ,BT, AL

Number of layers

2~24 Layers

Copper Thickness

Original Copper Thickness H/H~4OZ (Finished Copper Thickness 1/1~5OZ )

Finished Board Thickness

0.25~5.0mm

MINIMUM TRACE / SPACE WIDTH (OUTERS)Minimum Trace Width/Space

3/3 mil

Minimum Finished Hole Size

Finished Hole Size:0.15mm Smallest Drilling Size: 0.2mm (It has to be drilled piece by pieces)

Minimum SMD Device Pitch Space

The Space between SMD pitch should be at least 8 mils so that the green solder mask can be printed between them. For the Black solder mask, this space should be at least 10 mils.

Minimum SMD Trace Width/Space

7/5 mil

Minimum board thickness for V-scoring

The minimum thickness for v-scoring is 0.3mm. If the board thickness is under 0.4mm, it only can score in one side of the board. The minimum thickness remaining after scoring is 0.2 mm.

Minimum Legend Size

6mil

Drilling Registration Tolerance

Drilling Hole Size Tolerance

Impedance Control Tolerance

±10%

Profiling Tolerance

CNC Routing±0.1mm ; V-CUT:±0.15mm

Surface Finishing

Immersion Gold, Immersion Silver, Immersion Tin ,Gold Plating, HASL, ENTEK, Pb-Free HASL

Maximum Aspect Ratio

Ratio of Board Thickness and Hole Size are 7